Description
1. Overview of the 240x35mm Aluminum Heatsink(PDF Drawing Download)
The 240x35mm aluminum heatsink is a precision-engineered solution for applications requiring high thermal efficiency in minimal space. Crafted from 6063-T5 aluminum alloy, this extruded heatsink achieves 35% lower thermal resistance compared to bonded designs, ensuring reliable performance under continuous loads up to 300W. Its compact dimensions (240mm × 35mm) and lightweight profile make it ideal for integration into 5G modules, IoT devices, and precision industrial controllers.
2. Material Excellence: 6063-T5 Aluminum Alloy
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Thermal Conductivity: 180 W/m·K for rapid heat transfer from critical components.
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Durability: Hard anodized coating (25μm) resists oxidation and chemical exposure, compliant with MIL-A-8625 standards.
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Flexibility: Compatible with custom machining for niche mounting requirements.
Alt text: “240x35mm aluminum heatsink cooling a 5G small cell module”
3. Technical Specifications & Design Innovations
| Parameter | Specification |
|---|---|
| Dimensions | 240mm (L) × 35mm (W) |
| Material | 6063-T5 Aluminum Alloy |
| Thermal Resistance | 0.35°C/W @ 250W |
| Surface Treatment | Type II Anodizing (MIL-A-8625) |
| Max Operating Temp | 145°C |
| Compliance | RoHS, REACH, ISO 9001:2015 |
Key Features
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Low-Profile Design: Optimizes airflow in confined spaces (e.g., server blades or IoT gateways).
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Unibody Extrusion: Eliminates interfacial resistance, improving heat dissipation by 18%.
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Modular Compatibility: Pre-drilled slots for M4/M5 fasteners, aligning with standard PCB mounts.
4. Key Applications in Electronics & Precision Systems
This heatsink excels in:
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5G Telecommunications:
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Thermal management for small cell base stations and RF power amplifiers.
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Compliant with ETSI EN 303 413 for telecom equipment.
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Consumer Electronics:
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Cooling high-performance GPUs in compact gaming consoles or mini-PCs.
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Industrial Automation:
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Stabilizing temperatures in PLCs and motion control systems.
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Explore our compact cooling solutions for tailored configurations.
5. Comparative Advantage: Extruded vs. Bonded Solutions
| Criterion | 240x35mm Extruded Heatsink | Bonded Heatsink |
|---|---|---|
| Thermal Efficiency | 0.35°C/W @ 250W | 0.60°C/W @ 250W |
| Production Lead Time | 2 weeks | 6–8 weeks |
| Lifespan | 12+ years | 4–6 years |
| Cost Efficiency | 30% lower total cost | Higher adhesive costs |
Extruded designs dominate in reliability and thermal performance.
6. Installation Guidelines for Compact Environments
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Surface Preparation:
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Clean with isopropyl alcohol; ensure surface flatness ≤0.2mm/m.
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Thermal Interface:
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Apply non-silicone thermal paste (e.g., Arctic MX-6) for optimal contact.
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Secure Mounting:
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Use nylon screws to avoid short circuits in sensitive electronics.
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For step-by-step guidance, watch our compact system installation video.
7. Case Study: 5G Small Cell Thermal Optimization
A telecom provider deployed the 240x35mm heatsink in urban 5G nodes, achieving:
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20°C Temperature Drop: Critical components stabilized below 65°C.
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Zero Downtime: During peak summer operations (ambient 40°C).
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Certification: Passed GR-487 for outdoor equipment reliability.
8. Sustainability & Compliance
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Recyclability: 100% recyclable aluminum, supporting green manufacturing.
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Energy-Efficient Production: Extrusion reduces CO₂ emissions by 40% vs. die-casting.
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Certifications: CE Marking, IEC 62368-1 for IT equipment safety.
9. FAQs
Q: Can this heatsink handle overclocked CPUs in mini-PCs?
A: Yes! Tested with 95W TDP processors under continuous load.
Q: Is it suitable for outdoor IoT sensors?
A: Absolutely. IP54-rated variants are available for harsh environments.
Q: How to clean dust from tight spaces?
A: Use anti-static brushes or low-pressure air blowers.
